50-03-0584-0029
Specifications
Category:
RF And Wireless
RFI And EMI - Shielding And Absorbing Materials
Adhesive:
-
Product Status:
Active
Thickness - Overall:
-
Package:
Bulk
Series:
CHO-BOND® 584-29
Material:
Epoxy, 2 Part
Mfr:
Parker Chomerics
Shelf Life Start:
Date Of Manufacture
Width:
-
Shape:
-
Length:
-
Shelf Life:
12 Months
Storage/Refrigeration Temperature:
77°F (25°C)
Operating Temperature:
-
Type:
EMI Conductive Adhesive
Base Product Number:
50-03
Introduction
RF EMI EMI Conductive Adhesive CHO-BOND® 584-29 Epoxy, 2 Part X X
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